Specification：0.3t mm x 13 mm x 19 mm
Material：silicone + fiberglass
Applicable：transistor, Power supply
. The shape of this series products applicable to fill the PC board and heat sink or metal chassis of the air gap and minimize air thermal impedance, good thermal conductivity and high voltage insulation, the material itself has certain flexibility, good fit between power device and heat dissipation aluminum or machine shell, so as to achieve the best thermal conductivity and heat dissipation, electronics industry to meet the requirement for thermal conductive materials.
1.Flexible insulation silica sheet ,
Field effect transistor,
Large power transistor,
Power supply voltage regulator module,
A variety of audio power amplifier module,
High-power silicone controlled rectifier module, integrated rectifier module .
Regular size : 0.3t mm x 13 mm x 19 mm , Color : grey
Special size and color , can according customer's requirement to cut the shape , with/without adhesive are available
Package : 1000pcs/bag